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Form Factor/Height
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Full-wide 1U tray; 1 node+GPUs per tray
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Chassis
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DW612S Enclosure (6U)
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Processors
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1x or 2x 4th Generation AMD EPYC<000000>trade; Processors per node
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ذاكرة
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Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
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I/O Expansion
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NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
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Acceleration
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NVIDIA HGX<000000>trade; H100 4-GPU with 4x NVLink connected SXM5 GPUs
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Storage
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* Up to 2x 2.5" NVMe SSDs (7mm height) or 1x 2.5" NVMe SSDs (15mm height) per node
* Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions |
RAID Support
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OS Software RAID
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Network Interfaces
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Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
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Power Management
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Rack-level power capping and management via open-source management software Confluent and application-level energy optimization
through Energy Aware Runtime (EAR) |
Systems Management
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Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity
Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements |
Front access
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All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External
Diagnostics Handset port for local management. |
Rear access
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2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
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Power Supply
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* Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or
* Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy |
Cooling Design
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Direct Water Cooling at the heat source with up to 45°C inlet water temperature
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Courriel:
Lilicheng0510@163.com
FLAT / RM P, 4 / F, Lladro Center, 72 Hoi Yuen Road, Kwun Tong, Hong Kong, Chine