L Enovo Thinksystem Sd530 Xeon Gold 5215 Direct Water Cooled Server High-density Server
5.0
Samples:
$3299.0/piece | Min. order : 1 piece
Shipping:
Support Sea freight
Place of Origin:
China
Payments:
L/C,D/A,D/P,T/T,Western Union,MoneyGram,OA
Lead Time:
1-10(pieces):3(days),11-100(pieces):7(days),101-500(pieces):15(days),>500(pieces):To be negotiated(days)
Customization:
Customized logo (Min. Order: 10000 sets),Customized packaging (Min. Order: 10000 sets),Graphic customization (Min. Order: 10000 sets)
Brand Name:
Lenovo
Model Number:
SD530
design customization
Please fill out the form below to request a quote or to request more information about us. Please be sure to upload customized requirement documents or pictures, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Power
2x hot-swap/redundant 1+1 1600W/2000W; or 2x non-redundant 1100W
Brand
Lenovo ThinkSystem
Memory
Up to 2TB in 16x slots, using 128GB 3DS RDIMMs
Form Factor
2U rack enclosure
processor main frequency
2.5Ghz
Processor Type
In tel Xeon Gold 5215
Products Status
Stock
Private Mold
NO
Place of Origin
Guangdong, China
Type
Rack
Lenovo ThinkSystem SD530 High-density server
Products Description
Dense optimized
ThinkSystem SD530 consists of a modular 2U Lenovo D2 Enclosure containing up to four front-access SD530 servers (nodes). Each node, incorporating two powerful Intel® Xeon® Processor Scalable family CPUs, achieves up to 36% faster performance than the previous generation.*
ThinkSystem SD530 consists of a modular 2U Lenovo D2 Enclosure containing up to four front-access SD530 servers (nodes). Each node, incorporating two powerful Intel® Xeon® Processor Scalable family CPUs, achieves up to 36% faster performance than the previous generation.*
Modular design
The innovative design of the D2 enclosure provides the flexibility to meet varied needs in the modern data center. With multiple shuttle options, SharedIO, optional GPU tray, and support for Lenovo Neptune Thermal Transfer Module, the SD530 can be easily customized to your specific workload needs.
The innovative design of the D2 enclosure provides the flexibility to meet varied needs in the modern data center. With multiple shuttle options, SharedIO, optional GPU tray, and support for Lenovo Neptune Thermal Transfer Module, the SD530 can be easily customized to your specific workload needs.
Workload-optimized support
Intel® Optane™ DC Persistent Memory delivers a new, flexible tier of memory designed specifically for data center workloads that offers an unprecedented combination of high capacity, affordability, and persistence. This technology will have a significant impact on real-world data center operations: reduction of restart times from minutes down to seconds, 1.2x virtual machine density, dramatically improved data replication with 14x lower latency and 14x higher IOPS, and greater security for persistent data built into hardware.*
Intel® Optane™ DC Persistent Memory delivers a new, flexible tier of memory designed specifically for data center workloads that offers an unprecedented combination of high capacity, affordability, and persistence. This technology will have a significant impact on real-world data center operations: reduction of restart times from minutes down to seconds, 1.2x virtual machine density, dramatically improved data replication with 14x lower latency and 14x higher IOPS, and greater security for persistent data built into hardware.*
Specification
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Form Factor/Height
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2U rack enclosure; 4 independent compute nodes
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|
Processor
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Up to 2 second-generation Intel® Xeon® Platinum processors, up to 205W
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Memory
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Up to 2TB in 16x slots, using 128GB 3DS RDIMMs; 2933MHz TruDDR4
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Expansion Slots
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1x shuttle per D2 enclosure: either x8 PCIe Shuttle with 8x PCIe 3.0 x8 slots (2 per node); or x16 PCIe Shuttle with 4x PCIe 3.0
x16 slots (1 per node). Up to 2x external 1U trays (with up to 2 GPUs per node each)
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Drive Bays
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Up to 24x (6x per node) hot-swap 2.5" SAS/SATA HDDs/SSDs; up to 16x (4x per node) hot-swap 2.5" NVMe SSDs
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Network Interface
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Optional 8-port EIOM 10Gb SFP+ (2 ports per node); optional 8-port EIOM 10GbaseT RJ45 (2 ports per node)
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Power Supply
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2x hot-swap/redundant 1+1 1600W/2000W; or 2x non-redundant 1100W
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Hot-Swap Components
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Power supplies, fans, SAS/SATA/NVMe storage devices; compute nodes are warm-swap
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RAID Support
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SW RAID supports JBOD; Entry RAID; optional HW RAID 12Gb supports JBOD; plus M.2 boot support with optional RAID
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Systems Management
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XClarity Controller embedded management, XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins,
and XClarity Energy Manager centralized server power management
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